Composición adhesiva reticulable por calentamiento

• Main Authors: GOUBARD, DAVID M, LAFERTE, OLIVIER M
• Format: Patent
• Language: Spanish
• Published: 25.07.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Composición adhesiva reticulable por calentamiento que comprende: de 20 a 85% en peso/peso de un poliéter (A) que comprende dos grupos terminales de tipo alcoxisilanohidrolizables, que tiene una viscosidad medida a 23ºC que va de 25 a 40 Pa.s y como fórmula (I) : en la que: - R1 y R2, iguales o diferentes, representan cada uno un radical alquilo lineal o ramificado de 1 a 4 átomos decarbono, con la posibilidad, cuando hay varios radicales R1 (o R2), que estos sean iguales o diferentes; - R3 representa un radical alquileno divalente lineal que comprende de 1 a 6 átomos de carbono; - R4 representa un radical alquileno divalente lineal o ramificado que comprende de 1 a 4 átomos de carbono; - n es un número entero tal que la masa molar media numérica Mn del polímero de fórmula (I) está comprendidaentre 20 kDa y 40 kDa; - p es un número entero igual a 0, 1 o 2; - de 15 a 80% en peso/peso de una resina fijadora compatible (B), de masa molar media numérica comprendidaentre 200 Da y 10 kDa; y - de 0,01 a 3% de un catalizador de reticulación (C); estando determinadas dichas masas molares medias numéricas mediante cromatografía por permeación en gel,estando calibrada la columna con patrones de poliestireno. Adhesive composition curable by heating, comprises: 20-85% of a polyether (A) comprising two terminal groups of hydrolyzable alkoxysilane type, having a viscosity measured at 23[deg] C of 25-40 Pa.s; 15-80% of a compatible tackifying resin (B) having number average molecular weight of 200-10 kDa; and 0.01-3% of a crosslinking catalyst (C). Adhesive composition curable by heating, comprises: 20-85% of a polyether of formula ((R1O) 3 - p(R2) pSi-R3-NH-C(=O)-[OR4] n-O-C(=O)-NH-R3-Si(R2) p(OR1) 3 - p) (A) comprising two terminal groups of hydrolyzable alkoxysilane type, having a viscosity measured at 23[deg] C of 25-40 Pa.s; 15-80% of a compatible tackifying resin (B) having number average molecular weight of 200-10 kDa; and 0.01-3% of a crosslinking catalyst (C). R1, R2 : 1-4C alkyl, with the possibility when there is more R1 or R2 groups present then they are identical or different; R3 : 1-6C divalent linear alkylene; R4 : 1-4C divalent linear or branched alkylene; n : the number average molecular weight (Mn) of the polymer (A) i.e. 20-40 kDa; and p : 0-2. An independent claim is included for self-adhesive backing that can be obtained by the method comprising: (a) preheating the adhesive composition at 50-130[deg] C, (b) a coating on a support layer, and (c) crosslinking by heating the substrate and coating at 50-150[deg] C.