PROCEDIMIENTO PARA LA UNION Y LA FABRICACION DE COMPONENTES DE MICROESTRUCTURAS Y LAMINAS MICROESTRUCTURADAS APTAS PARA COMPONENTES DE MICROESTRUCTURAS

• Main Authors: CRAMER, KONRAD, HERBER, RALPH, SCHWIEKENDICK, CARSTEN, FRIZ, WOLFANG, MEYER, HEINRICH, KURTZ, OLAF
• Format: Patent
• Language: Spanish
• Published: 01.04.2007
• Subjects: APPARATUS THEREFOR; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Procedimiento para unir láminas de componentes mi- croestructuradas hechas de un material perteneciente al grupo que comprende metales y aleaciones metálicas y aptas para la fabricación de componentes para microestructuras, en el que se aplica a las láminas de unión como mínimo una capa de ba- rrera multifuncional y sobre esta capa de barrera ¿de la que existe como mínimo una¿, una capa de metal de aporte, se api- lan las distintas láminas de componentes y se sueldan segui- damente por aplicación de calor. Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering under the action of heat. An Independent claim is also included for a microstructured component comprising a stack of microstructured component layers having a barrier layer and solder layer between them.