PROCEDIMIENTO PARA LA MEJORA DE LA ADHERENCIA DE RESINAS DE ACRILATO

• Main Authors: MENZEL, KLAUS, ENENKEL, PETER, BECK, ERICH, KEIL, EDMUND, LOKAI, MATTHIAS, REICH, WOLFGANG
• Format: Patent
• Language: Spanish
• Published: 16.04.2005
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

Procedimiento para la mejora de la adherencia de resinas de acrilato endurecibles por radiación, que contienen un compuesto con al menos un grupo amino, y al menos un grupo acrilato insaturado endurecible por radiación, sobre substratos, caracterizado porque se añade con mezclado a las resinas de acrilato al menos un compuesto de poliepóxido con un valor de epóxido de 1 a 15 mol/kg, se aplica la mezcla obtenida sobre el substrato, y se endurece con radiación rica en energía, y mediante el tratamiento a una temperatura por encima de aproximadamente 50ºC. A process for improving the adhesion of radiation curable acrylate resins, containing an amine group and a radiation curable unsaturated acrylate group, to a substrate is claimed. The acrylate resin is mixed with a curable polyepoxide compound having an epoxy value of 1-15 mol/kg, the mixture applied to the substrate and cured with energetic radiation at greater than 50 degrees C.