METODO PARA ENCOLAR, DISPOSITIVO PARA REALIZAR EL METODO Y COMPOSICION DE ENCOLADO QUE SE UTILIZA EN EL METODO

• Main Authors: BOLM, HELENE, KAREM, JAAN
• Format: Patent
• Language: Spanish
• Published: 01.12.2002
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

LA INVENCION SE REFIERE A UN METODO DE ENCOLADO Y A UNA COLA UTILIZADA EN DICHO METODO. COMO AGLUTINANTE, LA COLA CONTIENE UNO O VARIOS PLASTICOS TERMOENDURECIBLES PROCEDENTES DEL GRUPO DE LOS POLIESTERES, ACRILICOS O EPOXI, UN SISTEMA CURANTE Y ADITIVOS, COMO ADITIVOS NIVELADORES DE LA REDUCCION DE VISCOSIDAD Y AGENTES PROMOTORES DE ADHESION. LA COLA SE PREPARA EN FORMA DE POLVO Y SE APLICA SOBRE UNA O AMBAS SUPERFICIES A ENCOLAR EN ESTADO SECO, Y SE CALIENTA HASTA UN ESTADO PEGAJOSO, DE FORMA QUE SE ADHIERE A LA SUPERFICIE REVESTIDA. FINALMENTE, LAS SUPERFICIES SE PRESIONAN ENTRE SI, CON LA COLA PARCIAL O COMPLETAMENTE FUNDIDA ENTRE ELLAS. LA CURACION SE REALIZA MANTENIENDO UNA TEMPERATURA ADECUADA PARA LAS PROPIEDADES DE CURACION DE LA COLA, DURANTE UN TIEMPO ADAPTADO, DE FORMA QUE LA CURACION DE LOS PLASTICOS SE PRODUCE ALTERNATIVAMENTE, EXPONIENDO LA COLA PEGAJOSA APLICADA A UNA RADIACION INICIADORA DE LA CURACION, INMEDIATAMENTE ANTES DE PRESIONAR LAS SUPERFICIES ENTRE SI. PCT No. PCT/SE96/01642 Sec. 371 Date Dec. 15, 1998 Sec. 102(e) Date Dec. 15, 1998 PCT Filed Dec. 12, 1996 PCT Pub. No. WO97/21777 PCT Pub. Date Jun. 19, 1997Methods for gluing a pair of surfaces are disclosed including preparing a glue from a polymer in the form of a powder, the glue having a melting temperature of up to about 100 DEG C. and being curable by electromagnetic radiation, applying the powder in a dry state to at least one of the two surfaces, heating a region proximate to at least one of the surfaces whereby the powder melts but does not cure, subjecting that surface to electromagnetic radiation to initiate curing of the powder, and joining the two surfaces together prior to completion of curing whereby the two surfaces adhere to each other by means of the tackiness of the glue and are maintained together by the subsequently cured glue. Apparatus for gluing the two surfaces together are also discussed, as are glue compositions for use therein.