Poly-microalloyed copper with high electrical conductivity and thermal and mechanical properties superior to those of conventional copper-based alloys

• Main Authors: GARCIA ZAMORA MIGUEL, SEGARRA RUBIX MERCE, GUIXA ARDERIU JOSE ORIOL, CHIMENOS RIBERA JOSEP MARIA, ESPIELL ALVAREZ FERRAN, FERNANDEZ LOPEZ MIGUEL ANGEL
• Format: Patent
• Language: English; Spanish
• Published: 16.04.2000
• Edition: 7
• Subjects: ALLOYS; CHEMISTRY; FERROUS OR NON-FERROUS ALLOYS; METALLURGY; TREATMENT OF ALLOYS OR NON-FERROUS METALS

Poly-microalloyed copper with high electrical conductivity and thermal and mechanical properties superior to those of conventional copper-based alloys. The poly-microalloyed copper of the invention is applicable as a metal base for electrical circuits, which significantly improves the important physical characteristics of said metal bases, since it exhibits high electrical conductivity and thermal and mechanical properties superior to the conventionally used copper-based alloys. To this end the poly-microalloyed copper consists of a poly-microalloy based on copper of high purity which includes multiple alloying metals, preferably Pb, Sn, Ag, Ni, Sb, Fe and Zn, in concentrations between 20 and 500 grams per ton of alloy, depending on the metal. Poly-microalloyed copper with high electrical conductivity and thermal and mechanical properties superior to those of conventional copper-based alloys. The poly-microalloyed copper of the invention is applicable as a metal base for electrical circuits, which significantly improves the important physical characteristics of said metal bases, since it exhibits high electrical conductivity and thermal and mechanical properties superior to the conventionally used copper-based alloys. To this end the poly-microalloyed copper consists of a poly-microalloy based on copper of high purity which includes multiple alloying metals, preferably Pb, Sn, Ag, Ni, Sb, Fe and Zn, in concentrations between 20 and 500 grams per ton of alloy, depending on the metal. (Machine-translation by Google Translate, not legally binding) Cobre poli-microaleado con elevada conductividad eléctrica y propiedades térmicas y mecánicas superiores a las de las aleaciones base cobre convencionales. El cobre poli-microaleado de la invención es aplicable como base metálica para circuitos eléctricos, que mejora notablemente las características físicas importantes de las citadas bases metálicas, ya que presenta una conductividad eléctrica elevada y unas propiedades térmicas y mecánicas superiores a las aleaciones base cobre utilizadas convencionalmente. Para lo cual, el cobre poli-microaleado consiste en una poli-microaleación a base de cobre de elevada pureza que comprende múltiples metales aleantes; preferentemente Pb, Sn, Ag, Ni, Sb, Fe y Zn, en concentraciones entre 20 y 500 gramos por tonelada de aleación, dependiendo del metal.