METODO DE DEPOSICION DE MATERIAL QUE CONTIENE SI O GE SOBRE UNA SUPERFICIE DE CU O NI

• Main Authors: FARRELL, CURTIS EDWARD, KANG, SUNG KWON, BRADY, MICHAEL JOHN, MARINO, JEFFREY ROBERT
• Format: Patent
• Language: Spanish
• Published: 16.07.1999
• Edition: 6
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

SE DESCRIBEN CIERTOS MATERIALES QUE CONTIENEN SILICIO Y GERMANIO,UTILES EN LA SUPERFICIE DE CONDUCTORES DE DISPOSITIVOS ELECTRONICOS.LA SOLDADURA PUEDE SER LLEVADA A CABO DE FORMA DESAGREGADA Y LOS HILOS PUEDEN ENLAZARSE EN TALES SUPERFICIES.ESTOS MATERIALES SE UTILIZAN COMO REVESTIMIENTOS SUPERFICIALES DE ARMAZONES DE PLOMO PARA PAQUETES DE CHIPS DE CIRCUITOS INTEGRADOS.ESTOS MATERIALES PUEDEN SER TRANSFERIDOS SOBRE SUPERFICIES CONDUCTORAS O DISPUESTOS SOBRE ELLAS ELECTRONICA Y ELECTROLITICAMENTE. Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.