Electroplating bath and process for white palladium

The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide r...

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Bibliographic Details
Main Authors TOO ELENA, PANECCASIO JR. VICENT
Format Patent
LanguageEnglish
Spanish
Published 16.06.1997
Edition6
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
HETEROCYCLIC COMPOUNDS
METALLURGY
ORGANIC CHEMISTRY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide range of plating thicknesses. BAÑO GALVANOPLASTICA Y PROCESO PARA PALADIO BLANCO. LA PRESENTE INVENCION SE RELACIONA CON UN BAÑO GALVANOPLASTICO DE PALADIO MEJORADO Y LIBRE DE ADITIVOS METALICOS CONSISTENTE EN EL USO DE UN COMPUESTO ACIDO SULFONICO EN COMBINACION CON UNA CLASE ESPECIAL DE COMPUESTOS NITROGENADOS RELACIONADOS CON LA PIRIDINA TANTO PARA ESTABILIZAR EL BAÑO COMO PARA PROPORCIONAR DEPOSITOS BLANCOS DE PALADIO EN UN AMPLIO RANGO DE GROSORES DE CHAPADO.
Bibliography:Application Number: ES19940001818