JOINING METHODS AND DEVICES MADE USING SAID METHODS
Disclosed herein are joining methods (e.g., methods of forming a joined material) and devices comprising materials joined by said methods. For example, the disclosed subject matter related to methods of joining one or more metallized polymer current collectors together and/or to a tab. For example,...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
06.08.2025
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed herein are joining methods (e.g., methods of forming a joined material) and devices comprising materials joined by said methods. For example, the disclosed subject matter related to methods of joining one or more metallized polymer current collectors together and/or to a tab. For example, the methods can comprise: placing one or more metallized polymer current collector proximate a tab, such that at least a portion of the metallized polymer current collector(s) overlaps with at least a portion of the tab in an overlap region; placing a conductive material proximate the overlap region; inducing flow of the conductive material such that the conductive material flows at least between the portion of the metallized polymer current collector(s) and the portion of the tab; and subsequently solidifying the conductive material, thereby forming a joint that joins the metallized polymer current collector(s) to the tab. |
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Bibliography: | Application Number: EP20230873489 |