RELEASE FILM AND LAYERED PRODUCT THEREOF, AND PRODUCTION METHOD FOR FILM ELECTRODE ASSEMBLY

• Main Authors: TANAKA, Ryotaro, NISHIMURA, Kanae, CHIASHI, Masanori
• Format: Patent
• Language: English; French; German
• Published: 30.10.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; TRANSPORTING

There are provided a mold release film having excellent handleability and mold releasability even when used in a high-temperature environment, a laminate thereof, and an application thereof. A mold release film is prepared to include at least a substrate layer and a mold release layer directly or indirectly layered on at least one surface of the substrate layer. The mold release layer contains a polypropylene-based resin. The mold release film may have a thermal shrinkage rate of approximately 4.0% or less when subjected to a heating treatment under conditions of 160°C and 15 minutes. Further, a mold release film may be prepared to include at least a mold release layer containing a polypropylene-based resin. The mold release film has a thermal shrinkage rate of 4.0% or less when subjected to a heating treatment under conditions of 160°C and 15 minutes.