SEMICONDUCTOR DEVICE
A semiconductor device includes a first electrode (11), a second electrode (14), a first semiconductor layer (21+22), a third electrode (12), a second semiconductor layer (23), a third semiconductor layer (24), a fourth electrode (13), and a fourth semiconductor layer (25). The third semiconductor l...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
18.09.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device includes a first electrode (11), a second electrode (14), a first semiconductor layer (21+22), a third electrode (12), a second semiconductor layer (23), a third semiconductor layer (24), a fourth electrode (13), and a fourth semiconductor layer (25). The third semiconductor layer extends from the second semiconductor layer toward the first electrode side. A lower end (24a) of the third semiconductor layer at the first electrode side is positioned further toward the first electrode side than the lower surface of the second semiconductor layer and is separated from the insulating body. The fourth electrode faces the second semiconductor layer via an other portion (32) of an insulating body (30). The fourth semiconductor layer is located between the second semiconductor layer and the second electrode and electrically connected with the second electrode. |
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Bibliography: | Application Number: EP20230192327 |