PACKAGING STRUCTURE

• Main Authors: CUI, Zhaoxue, LIU, Ren, LI, Ping, DU, Lin, LIANG, Tao
• Format: Patent
• Language: English; French; German
• Published: 11.09.2024
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A packaging structure is provided, and may include a housing and a power component. The power component is disposed inside the housing. The housing may include a top cover and a bottom housing. The top cover and the bottom housing are connected to form the housing. The top cover may have a first heat transfer medium channel inside. The bottom housing may have a second heat transfer medium channel inside. The first heat transfer medium channel and the second heat transfer medium channel are separately configured to communicate with an external heat dissipation circulation system. The power component may include a first circuit board and a second circuit board. The first circuit board and the second circuit board may be disposed opposite to each other. The first circuit board may be disposed on the top cover, and the second circuit board may be disposed on the bottom housing. At least one first heating device may be disposed on the first circuit board. The first heating device may press against an inner wall of the top cover. At least one second heating device may be disposed on the second circuit board, and the second heating device may press against an inner wall of the bottom housing. When the foregoing structure is used, high power density and high heat dissipation efficiency can be achieved.