METHOD AND DEVICE FOR COMPENSATING DISTORTION
The invention relates to a method and a device for compensating (7) distortions (4) on a substrate surface (1a,1p) of a substrate (1). The invention also relates to a method for bonding two substrates and a product.
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| Main Authors | , , , , , , , |
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| Format | Patent |
| Language | English French German |
| Published |
11.09.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The invention relates to a method and a device for compensating (7) distortions (4) on a substrate surface (1a,1p) of a substrate (1). The invention also relates to a method for bonding two substrates and a product. |
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| AbstractList | The invention relates to a method and a device for compensating (7) distortions (4) on a substrate surface (1a,1p) of a substrate (1). The invention also relates to a method for bonding two substrates and a product. |
| Author | BURGGRAF, Jürgen WAGENLEITNER, Thomas LINDNER, Friedrich, Paul UHRMANN, Thomas FINGER, Martin WIMPLINGER, Markus ZINNER, Dominik ROHRINGER, Harald |
| Author_xml | – fullname: LINDNER, Friedrich, Paul – fullname: WIMPLINGER, Markus – fullname: UHRMANN, Thomas – fullname: WAGENLEITNER, Thomas – fullname: ROHRINGER, Harald – fullname: ZINNER, Dominik – fullname: FINGER, Martin – fullname: BURGGRAF, Jürgen |
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| DocumentTitleAlternate | VERFAHREN UND VORRICHTUNG ZUR KOMPENSATION VON VERZERRUNGEN PROCÉDÉ ET DISPOSITIF DE COMPENSATION DE DÉFORMATION |
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| Notes | Application Number: EP20210806167 |
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| RelatedCompanies | EV Group E. Thallner GmbH |
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| Snippet | The invention relates to a method and a device for compensating (7) distortions (4) on a substrate surface (1a,1p) of a substrate (1). The invention also... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | METHOD AND DEVICE FOR COMPENSATING DISTORTION |
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