METHOD AND DEVICE FOR COMPENSATING DISTORTION

The invention relates to a method and a device for compensating (7) distortions (4) on a substrate surface (1a,1p) of a substrate (1). The invention also relates to a method for bonding two substrates and a product.

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Bibliographic Details
Main Authors LINDNER, Friedrich, Paul, WIMPLINGER, Markus, UHRMANN, Thomas, WAGENLEITNER, Thomas, ROHRINGER, Harald, ZINNER, Dominik, FINGER, Martin, BURGGRAF, Jürgen
Format Patent
LanguageEnglish
French
German
Published 11.09.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a method and a device for compensating (7) distortions (4) on a substrate surface (1a,1p) of a substrate (1). The invention also relates to a method for bonding two substrates and a product.
Bibliography:Application Number: EP20210806167