POWER MODULE HAVING SEMICONDUCTOR COMPONENTS AND INCORPORATING A TEMPERATURE SENSOR, AND ASSOCIATED MANUFACTURING METHOD

The invention relates to a power module (31) comprising: - a plurality of semiconductor power components (37); - a substrate (33) comprising an upper metallization (45) that receives the components (37) and a lower metallization (47) opposite the upper metallization (45); - optionally, a base plate...

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Bibliographic Details
Main Authors KHAZAKA, Rabih, PHAN HUY, Minh Chau, SALHI, Nassim, FEDI, Baptiste Joël Christian
Format Patent
LanguageEnglish
French
German
Published 04.09.2024
Subjects
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:The invention relates to a power module (31) comprising: - a plurality of semiconductor power components (37); - a substrate (33) comprising an upper metallization (45) that receives the components (37) and a lower metallization (47) opposite the upper metallization (45); - optionally, a base plate (49) attached to the lower metallization (47) of the substrate (33); - a metal structure (56) in direct contact with a lower face (54) defined by the base plate (49) or the substrate (33), on a side opposite the components (37); and - at least one elongate temperature sensor (58), at least partially embedded in the metal structure (56) and extending in parallel with the lower face (54).
Bibliography:Application Number: EP20220813659