THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF

Provided is a thermally conductive adhesive composition, comprising: a) from 0.5 to 30%, preferably from 2 to 20% by weight of an epoxy resin, b) from 0.5 to 30%, preferably from 2 to 20% by weight of an anhydride, c) from 0.1 to 5%, preferably from 0.5 to 3.5% by weight of a catalyst, and d) from 5...

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Bibliographic Details
Main Authors YAO, Wei, WU, Qili, HUANG, Chenyu, TI, Yang, YU, Yuanyuan
Format Patent
LanguageEnglish
French
German
Published 31.07.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:Provided is a thermally conductive adhesive composition, comprising: a) from 0.5 to 30%, preferably from 2 to 20% by weight of an epoxy resin, b) from 0.5 to 30%, preferably from 2 to 20% by weight of an anhydride, c) from 0.1 to 5%, preferably from 0.5 to 3.5% by weight of a catalyst, and d) from 50 to 98%, preferably from 60 to 95% by weight of a metal filler, based on the total weight of the thermally conductive adhesive composition, wherein the catalyst has a core-shell structure with a shell encapsulating a core, the core of the catalyst comprises an amine-based compound, and the shell of the catalyst is prepared by reacting at least two of an epoxy resin, an amine-based compound, and a polyisocyanate. Also provided are a preparation method and use of the thermally conductive adhesive composition.
Bibliography:Application Number: EP20210957837