HEATER ELEMENTS

The present disclosure relates to semiconductor structures and, more particularly, to heater elements, methods of operation and methods of manufacture. The structure includes: an active device; a heater element under the active device and within a semiconductor substrate; and a contact to the heater...

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Bibliographic Details
Main Authors JAIN, Vibhor, VENTRONE, Sebastian T, KANTAROVSKY, Johnatan A, NGU, Yves T, RAGHUNATHAN, Uppili S
Format Patent
LanguageEnglish
French
German
Published 07.08.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to semiconductor structures and, more particularly, to heater elements, methods of operation and methods of manufacture. The structure includes: an active device; a heater element under the active device and within a semiconductor substrate; and a contact to the heater element and the active device.
Bibliography:Application Number: EP20230202561