SEMICONDUCTOR DEVICE
A semiconductor device includes: a device structure including a first semiconductor substrate and having an active pattern extending in first direction, a conductive through-via electrically connected to a front wiring layer and penetrating through the first semiconductor substrate, wherein the firs...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French German |
Published |
17.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device includes: a device structure including a first semiconductor substrate and having an active pattern extending in first direction, a conductive through-via electrically connected to a front wiring layer and penetrating through the first semiconductor substrate, wherein the first semiconductor substrate has a non-planarized lower surface in which a peripheral region around the conductive through-via curves downward, a first bonding structure having a planarized insulating layer disposed on the second surface of the first semiconductor substrate and having a planarized upper surface. |
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Bibliography: | Application Number: EP20240150760 |