SEMICONDUCTOR DEVICE

A semiconductor device includes: a device structure including a first semiconductor substrate and having an active pattern extending in first direction, a conductive through-via electrically connected to a front wiring layer and penetrating through the first semiconductor substrate, wherein the firs...

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Bibliographic Details
Main Authors YOU, Wookyung, KANG, Minjae, RYU, Koungmin, SEO, Hoonseok, KANG, Sangkoo, KIM, Yeonggil, LEE, Woojin
Format Patent
LanguageEnglish
French
German
Published 17.07.2024
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Summary:A semiconductor device includes: a device structure including a first semiconductor substrate and having an active pattern extending in first direction, a conductive through-via electrically connected to a front wiring layer and penetrating through the first semiconductor substrate, wherein the first semiconductor substrate has a non-planarized lower surface in which a peripheral region around the conductive through-via curves downward, a first bonding structure having a planarized insulating layer disposed on the second surface of the first semiconductor substrate and having a planarized upper surface.
Bibliography:Application Number: EP20240150760