CURABLE PRECURSOR OF A COMPOSITION

The present disclosure relates to a curable precursor of a composition, the curable precursor comprising(a) a radically (co)polymerizable (meth)acrylate-based component;(b) a curing agent;(c) an inorganic filler having a mean particle size (d50) of at least 1 µm; and(d) a thixotropic agent which is...

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Bibliographic Details
Main Authors Shaaban, Ahmad, Jung, Adrian Thomas, Sprott, Sascha, Fritz, Emelie
Format Patent
LanguageEnglish
French
German
Published 26.06.2024
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The present disclosure relates to a curable precursor of a composition, the curable precursor comprising(a) a radically (co)polymerizable (meth)acrylate-based component;(b) a curing agent;(c) an inorganic filler having a mean particle size (d50) of at least 1 µm; and(d) a thixotropic agent which is a carbamate.The present disclosure further relates to the use of said curable precursorfor thermal management applications in the automotive and electronic industry;as an electrically insulating composition in the electronic industry and for cable insulation; andas a color pigment comprising composition in the coating and paint industry.
Bibliography:Application Number: EP20220215334