MICROMIRROR CHIP PACKAGING STRUCTURE, LASER APPARATUS, AND AUTOMOBILE

• Main Authors: ZHOU, Wu, WU, Jiahao, ZENG, Li
• Format: Patent
• Language: English; French; German
• Published: 19.06.2024
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; TRANSPORTING

Embodiments of this application provide a micromirror chip package structure, a laser device, and a vehicle, relate to the field of micro-electro-mechanical technologies, and mainly used to provide a micromirror chip package structure that can suppress a vibration amplitude of a micromirror chip. The micromirror chip package structure includes a micromirror chip, and a first substrate and a second substrate that are stacked, where the micromirror chip is disposed on a side that is of the first substrate and that faces away from the second substrate, where the micromirror chip includes a frame, a movable component, and a first torsion arm, and the movable component is connected to the frame through the first torsion arm; the first substrate includes a vibration isolation platform, an elastic beam, and a support frame, the micromirror chip is disposed on the vibration isolation platform, and the vibration isolation platform is connected to the support frame through the elastic beam; the support frame is fastened to the second substrate, and a gap is formed between the vibration isolation platform and the second substrate; and the vibration isolation platform and the second substrate each have a hollow area, and the hollow area is opposite to the movable component. The micromirror chip package structure is a two-degree-of-freedom system for vibration isolation, thereby improving performance of the micromirror chip.