CO-PACKAGED OPTICS ASSEMBLIES
An electro-optical assembly is provided. The electro-optical assembly includes a module having a module substrate, with the module substrate having a module waveguide. The electro-optical assembly also includes a circuit board having a circuit board substrate, with the circuit board substrate having...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
19.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | An electro-optical assembly is provided. The electro-optical assembly includes a module having a module substrate, with the module substrate having a module waveguide. The electro-optical assembly also includes a circuit board having a circuit board substrate, with the circuit board substrate having a circuit board waveguide. The electro-optical assembly also includes at least one integrated circuit proximate to the module. The module is assembled to the circuit board so that the circuit board waveguide is aligned with the module waveguide for optical coupling. |
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Bibliography: | Application Number: EP20220761317 |