SEMICONDUCTOR PACKAGE WITH INSERT

A semiconductor package includes a semiconductor die thermally coupled to a planar metal pad, an encapsulant body that encapsulates the semiconductor die and includes a recess that extends from an outer upper side of the encapsulant body towards a rear side of the planar metal pad, and an insert arr...

Full description

Saved in:
Bibliographic Details
Main Authors JÜRSS, Michael, SCHWAB, Stefan, SCHARF, Thorsten
Format Patent
LanguageEnglish
French
German
Published 29.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor package includes a semiconductor die thermally coupled to a planar metal pad, an encapsulant body that encapsulates the semiconductor die and includes a recess that extends from an outer upper side of the encapsulant body towards a rear side of the planar metal pad, and an insert arranged within the recess that is thermally coupled to the planar metal pad and extends to the outer upper side of the encapsulant body, wherein the insert that is arranged within the recess includes a curable polymer compound.
Bibliography:Application Number: EP20230212198