HEATSINK FOR COOLING ELECTRONIC DEVICE PACKAGES AND ASSOCIATED PACKAGING STACK

The heatsink (16, 17, 18, 19, 20) for cooling at least one electronic device package (12, 13, 14, 15) having an upper contact surface (12a, 13a, 14a, 15a) and a lower contact surface (12b, 13b, 14b, 15b) is proposed.The heat sink comprises a first cooling piece (24) and a support piece (23).The supp...

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Bibliographic Details
Main Authors Lenherr, Christian, Hamelin, Dimitri, Baerd, Henri, Clavier, Philippe
Format Patent
LanguageEnglish
French
German
Published 22.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The heatsink (16, 17, 18, 19, 20) for cooling at least one electronic device package (12, 13, 14, 15) having an upper contact surface (12a, 13a, 14a, 15a) and a lower contact surface (12b, 13b, 14b, 15b) is proposed.The heat sink comprises a first cooling piece (24) and a support piece (23).The support piece (23) and the first cooling piece (24) are two independent pieces so that the interface between the first surface of the support piece and the second surface of the first cooling piece allows a relative movement between the support piece and the first cooling piece along a direction parallel to the interface between the first cooling piece and the support piece.
Bibliography:Application Number: EP20220315290