FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS

A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2...

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Bibliographic Details
Main Authors SZENTIVANYI, Andreas, PHAM, Duy Vu, MERKULOV, Alexey, RUBAN, Eckart, FRANOSCH, Jürgen, RESING, Mario
Format Patent
LanguageEnglish
French
German
Published 08.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
CONDUCTORS
ELECTRICITY
INSULATORS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2) aryl phosphonate(s), (B3) carbohydrate polyol(s), (B4) melamine cyanurate(s), and (B5) optionally, non-phosphorus-comprising flame retardant(s). A total phosphorus content from the flame retardant composition may be in a range of from 0.5 to 1.5 wt. %, based on total polyamide molding compound weight
Bibliography:Application Number: EP20220735888