WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER

The present disclosure relates generally to radio engineering, and for example, to high-rate wireless data transfer between different printed circuit boards or between parts of the same printed circuit board. The technical result is easier fabrication, smaller dimensions, lower losses at high freque...

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Bibliographic Details
Main Authors MAKURIN, Mikhail Nikolaevich, LUKYANOV, Anton Sergeevich
Format Patent
LanguageEnglish
French
German
Published 17.04.2024
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TRANSMISSION
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Summary:The present disclosure relates generally to radio engineering, and for example, to high-rate wireless data transfer between different printed circuit boards or between parts of the same printed circuit board. The technical result is easier fabrication, smaller dimensions, lower losses at high frequencies and improved performance. According to the disclosure, a wireless data transfer system comprises: two printed circuit boards separated by an air gap, between which a transverse electromagnetic (TEM) mode waveguide is formed, wherein each printed circuit board includes a converter structure configured to: perform conversion between the signal transmission line mode and TEM mode in the waveguide, connected to an RF component; wherein the converter structure includes: an antenna, a signal transmission line between the antenna and the RF component, and at least one reflector configured to provide directive propagation of the TEM mode in the waveguide; wherein the width of the air gap between the printed circuit boards does not exceed λ/4, where λ is the wavelength of the transmitted signal.
Bibliography:Application Number: EP20220904689