ACCURATE AND FAST POWER MODULE TEMPERATURE ASSESSMENT

Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors (108) that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay (102)...

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Bibliographic Details
Main Authors YANG, Liqiang, LEE, Shung Ik, GRIMES, Darrell, CHO, Hyunmin
Format Patent
LanguageEnglish
French
German
Published 03.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors (108) that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay (102). A temperature sensor is physically bonded to a top surface of the conductive overlay (102) to provide a direct temperature measurement for the one or more power transistors (108).
Bibliography:Application Number: EP20230196916