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A technique capable of reducing, when processing a substrate by using a processing liquid, a burden in the processing and a burden in works involved in the processing is provided. A container includes a storage space forming unit 20 in which a storage space 59 storing therein a processing liquid con...

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Bibliographic Details
Main Authors HIRAO Takeshi, YAMAMOTO Takashi, KUTSUNA Yoshimichi, TSUCHIYA Katsuhiro, INADA Hiroichi
Format Patent
LanguageEnglish
French
German
Published 06.03.2024
Subjects
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:A technique capable of reducing, when processing a substrate by using a processing liquid, a burden in the processing and a burden in works involved in the processing is provided. A container includes a storage space forming unit 20 in which a storage space 59 storing therein a processing liquid configured to process a substrate is formed; a discharge port 25 of the processing liquid, provided in the storage space forming unit; and a fragile member 47 provided in the storage space forming unit and configured to be broken by being pressurized with a penetrating member in order to form an access path, the penetrating member being configured to pressurize the storage space such that the processing liquid is discharged from the discharge port, and the penetrating member being advanced into the storage space forming unit through the access path.
Bibliography:Application Number: EP20220795529