MICRONEEDLE PATCH

A microneedle patch according to one example includes a backing, an adhesive layer provided on the main surface of the backing, and a microneedle array at least a part of which is positioned within the adhesive layer, wherein the adhesive layer includes a water-soluble polymer and water, and a loss...

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Bibliographic Details
Main Authors KUWAHARA Tetsuji, TSURUSHIMA Keiichiro, WAKAMATSU Masato, ONO Masafumi, TATEISHI Tetsuro
Format Patent
LanguageEnglish
French
German
Published 28.02.2024
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Summary:A microneedle patch according to one example includes a backing, an adhesive layer provided on the main surface of the backing, and a microneedle array at least a part of which is positioned within the adhesive layer, wherein the adhesive layer includes a water-soluble polymer and water, and a loss tangent of the adhesive layer under measurement conditions of an environmental temperature of 25°C and a frequency of 1 Hz is 0.20 to 0.41.
Bibliography:Application Number: EP20220858545