HEAT DISSIPATION SYSTEM

A heat dissipation system (100, 100a, 100b) adapted to dissipate heat for an electronic device (10) includes a tank (110), a first heat exchanger (120, 120a, 120b), and a fluid delivery device (130). The tank (110) includes a first zone (111, 111a, 111b) and a second zone (112, 112a, 112b). A coolin...

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Bibliographic Details
Main Authors LIN, Jian-Hung, YANG, Chao-Chiang, HOU, Chih-Jen, HUANG, Ching-Chuan, ADACHI, Nobuhiro
Format Patent
LanguageEnglish
French
German
Published 21.02.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A heat dissipation system (100, 100a, 100b) adapted to dissipate heat for an electronic device (10) includes a tank (110), a first heat exchanger (120, 120a, 120b), and a fluid delivery device (130). The tank (110) includes a first zone (111, 111a, 111b) and a second zone (112, 112a, 112b). A cooling fluid is located in the first and second zones (111, 111a, 111b, 112, 112a, 112b). The electronic device (10) is adapted to be disposed in the first zone (111, 111a, 111b) and immersed in the cooling fluid. The first heat exchanger (120, 120a, 120b) is located at a junction of the first and second zones (111, 111a, 111b, 112, 112a, 112b) to reduce a temperature of the cooling fluid. The cooling fluid flows from the first zone (111, 111a, 111b) to the second zone (112, 112a, 112b) through the fluid delivery device (130).
Bibliography:Application Number: EP20220200223