CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE

A clip structure for a packaged semiconductor device. The packaged semiconductor device comprises a first die portion and a second die portion being electrically isolated from the first die portion. The clip structure comprises a first portion, a second portion and a gate wire bond. The first portio...

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Bibliographic Details
Main Authors Ting, Jia Yunn, Wing Onn, Chaw, Chang, Ting Wei
Format Patent
LanguageEnglish
French
German
Published 07.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A clip structure for a packaged semiconductor device. The packaged semiconductor device comprises a first die portion and a second die portion being electrically isolated from the first die portion. The clip structure comprises a first portion, a second portion and a gate wire bond. The first portion is electrically conductive, and the first portion is configured to integrally connect a source terminal with the first die portion. The second portion is electrically conductive and is electrically isolated from the first portion, and is configured to connect to a gate terminal. The gate wire bond is configured to connect the second portion with the second die portion.
Bibliography:Application Number: EP20220187990