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A head-mounted device includes a frame and a sensor coupled to the frame. The sensor includes a first conductive plate coupled to the frame and a first contact pad coupled to the frame and electrically coupled to the first conductive plate. The first contact pad includes an electrically conductive m...

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Bibliographic Details
Main Authors OUDENHOVEN, Michael J, LAU, Brian S, ANDERSON, Jonathan M
Format Patent
LanguageEnglish
French
German
Published 31.01.2024
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:A head-mounted device includes a frame and a sensor coupled to the frame. The sensor includes a first conductive plate coupled to the frame and a first contact pad coupled to the frame and electrically coupled to the first conductive plate. The first contact pad includes an electrically conductive material embedded in a non-electrically conductive material, and the first contact pad is resiliently flexible and is configured for facial engagement. The sensor is configured to generate a signal that indicates a change in a capacitance of the sensor, and a controller is configured to change a power state of the head-mounted device based on the signal.
Bibliography:Application Number: EP20230187056