RESIN COMPOSITION, FILM INCLUDING SAID RESIN COMPOSITION, AND USE THEREOF

• Main Authors: YOSHIMOTO Koya, IZAIKE Yuhei
• Format: Patent
• Language: English; French; German
• Published: 24.01.2024
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

A resin composition, wherein the content of a propylene-based polymer (A) satisfying a predetermined requirement is 10 to 99.9 parts by mass, the content of a propylene-based polymer (B) satisfying a predetermined requirement is 0 to 40 parts by mass, the content of a polyolefin (C) containing structural units derived from an unsaturated carboxylic acid and/or a derivative thereof is 0.1 to 20 parts by mass, and the content of an ethylene-based polymer (D) satisfying a predetermined requirement is 0 to 40 parts by mass, provided that the total content of components (A), (B), (C) and (D) is 100 parts by mass.