MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

• Main Authors: OGATA Hiroto, OKUNO Takahisa, YAGYU Masafumi
• Format: Patent
• Language: English; French; German
• Published: 17.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

Provided are a laminate including an adhesive layer that can implement easy peeling when a semiconductor substrate and a support substrate are separated after processing of the semiconductor substrate and can suppress deformation of a bump, and the like.A laminate includes a semiconductor substrate with a bump; a support substrate; a protective adhesive layer formed so as to be in contact with the semiconductor substrate with a bump; and a peeling adhesive layer formed between the protective adhesive layer and the support substrate,in which the protective adhesive layer is formed of a protective adhesive composition, and the protective adhesive composition contains a component (A) which is cured by a hydrosilylation reaction and does not contain a peeling agent component (B) which does not cause a curing reaction, andthe peeling adhesive layer is formed of a peeling adhesive composition, and the peeling adhesive composition contains a component (A) which is cured by a hydrosilylation reaction and a peeling agent component (B) which does not cause a curing reaction.