IGBT MODULE, ELECTRIC MOTOR CONTROLLER, AND VEHICLE
An insulated gate bipolar transistor (IGBT) assembly includes a wafer; a first heat dissipation plate and a second heat dissipation plate being disposed on two surfaces of the wafer in a thickness direction of the wafer respectively, a plurality of first heat dissipation pins being disposed at an in...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
03.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | An insulated gate bipolar transistor (IGBT) assembly includes a wafer; a first heat dissipation plate and a second heat dissipation plate being disposed on two surfaces of the wafer in a thickness direction of the wafer respectively, a plurality of first heat dissipation pins being disposed at an interval from each other on a surface of the first heat dissipation plate facing away from the second heat dissipation plate, and a plurality of second heat dissipation pins being disposed at an interval from each other on a surface of the second heat dissipation plate facing away from the first heat dissipation plate; and an insulating waterproof housing covering a portion of the wafer exposed from the first heat dissipation plate and the second heat dissipation plate. |
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Bibliography: | Application Number: EP20220794306 |