APPARATUS FOR POST EXPOSURE BAKE OF PHOTORESIST

A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an immersion bake head, which includes an electrode and is configured to be alterna...

Full description

Saved in:
Bibliographic Details
Main Authors DUKOVIC, John O, LUBOMIRSKY, Dmitry, NEMANI, Srinivas D, BUCHBERGER, JR., Douglas A
Format Patent
LanguageEnglish
French
German
Published 20.12.2023
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an immersion bake head, which includes an electrode and is configured to be alternated between a hot pedestal and a cold pedestal. The immersion bake head serves as a substrate carrier and applies an electric field to the substrate. The immersion bake head additionally serves to provide and remove process fluid from the substrate using a plurality of fluid conduits.
Bibliography:Application Number: EP20220753161