POWER MODULE PACK

Disclosed is a power module pack including a first cooling plate, a second cooling plate stacked on and coupled to the first cooling plate, and power modules interposed between the first cooling plate and the second cooling plate. Each of the power modules has a lower surface soldered to an upper su...

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Bibliographic Details
Main Authors NOH, Seung Jun, PARK, Se Min
Format Patent
LanguageEnglish
French
German
Published 13.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a power module pack including a first cooling plate, a second cooling plate stacked on and coupled to the first cooling plate, and power modules interposed between the first cooling plate and the second cooling plate. Each of the power modules has a lower surface soldered to an upper surface of the first cooling plate.
Bibliography:Application Number: EP20220216341