DEVICE AND METHOD FOR MEASURING THE CURING PROCESS OF A CURABLE MATERIAL BY MEANS OF DIELECTRIC SPECTROSCOPY

• Main Authors: GUTOWSKI, Rafael, WELLMANN, Stefanie, DOEKER, Andreas
• Format: Patent
• Language: English; French; German
• Published: 13.12.2023
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PERFORMING OPERATIONS; PHYSICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TESTING; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention relates to a device (10) and method for measuring the curing process of a curable material by means of dielectric spectroscopy, said device comprising:a mobile transmission unit (12) having a sensor (14) for making contact with a sample of the curable material, anda receiving unit (18), which is physically separate from the transmission unit (12), is configured to communicate wirelessly with the transmission unit (12) and contains an analysis device (22). The sensor (14) is formed on a sensor board (44) that is adapted to be detachably connected to the transmission unit, and the analysis device (22) of the receiving unit (18) is designed to determine, on the basis of frequency changes detected during a measurement process, at least three states:a first state of decreasing frequency which corresponds to the sample of the uncured material being applied to the sensor (14),a second state of a substantially constant first frequency which corresponds to a completed application of the sample of the uncured organic material to the sensor (14), anda third state of a substantially constant second frequency which corresponds to a desired curing state of the curable material being reached, wherein the constant second frequency is higher than the constant first frequency.