POWER SEMICONDUCTOR MODULES AND METHOD FOR THEIR ASSEMBLING

• Main Authors: Jiang, Ke, Qian, Qiuxiao, Zhu, Chunlin
• Format: Patent
• Language: English; French; German
• Published: 06.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides power semiconductor modules and their assembling methods. The power semiconductor module includes a heat-dissipation contact area, a housing and a press-on element. One of the housing and the press-on element includes a rail portion, while the other includes a rail cooperating portion. The housing and the press-on element respectively include a first limiting portion and a first limiting cooperating portion. The rail cooperating portion could be inserted into the rail portion and slides on the rail portion in the direction toward or away from the plane where the heat-dissipation contact area is located, so that the press-on element could move from the separation position to the mounted position connected with the housing. The rail portion could cooperate with the rail cooperating portion to prevent the press-on element from moving relative to the housing in the direction parallel to the plane where the heat-dissipation contact area is located. When the press-on element is located at the mounted position, the first limiting portion could cooperate with the first limiting cooperating portion to prevent the press-on element from moving relative to the housing in the direction toward the plane where the heat-dissipation contact area is located. The press-on element is configured for pressing the press-on element against the heat sink element in a state of being mounted on the heat sink element in the mounting position.