PROCESS ABNORMALITY IDENTIFICATION USING MEASUREMENT VIOLATION ANALYSIS

• Main Authors: CORRAL, Randy Raynaldo, WANG, Shijing, NAHAS, Selim, RAGAM, Vishali, WARREN, Eric J, REEVES, Christopher, LARGO, Charles, DOX, Joseph James
• Format: Patent
• Language: English; French; German
• Published: 01.01.2025
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS; COMPUTING; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PHYSICS; REGULATING; SEMICONDUCTOR DEVICES

The subject matter of this specification can be implemented in, among other things, a method, system, and/or device to receive current metrology data for an operation on a current sample in a fabrication process. The metrology data includes a current value for a parameter at each of one or more locations on the current sample. The method further includes determining a current rate of change of the parameter value for each of the one or more locations. The current rate of change is associated with the current sample. The method further includes identifying one or more violating locations each having an associated current rate of change of the parameter value that is greater than an associated reference rate of change of the parameter value, and identifying an instance of abnormality of the fabrication process based on the one or more violating locations.