METHOD FOR PRODUCING AT LEAST ONE CRACK-FREE SIC PIECE
The present invention refers to a method for producing at least one crack-free SiC piece at least comprising the steps:Providing a CVD reactor, wherein the CVD reactor comprises at least one SiC growth substrate, wherein the at least one SiC growth substrate comprises a main body, a first power conn...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
22.11.2023
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Subjects | |
Online Access | Get full text |
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