ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE
According to various embodiments, an electronic device comprises: a housing; a support member which is disposed in the inner space of the housing, and which includes a first surface oriented in a first direction and a second surface oriented in a second direction that is opposite to the first surfac...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
01.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | According to various embodiments, an electronic device comprises: a housing; a support member which is disposed in the inner space of the housing, and which includes a first surface oriented in a first direction and a second surface oriented in a second direction that is opposite to the first surface; at least one pattern formed to have a length in a designated direction in at least a part of the first surface and/or the second surface of the support member; and a heat dissipation coating layer stacked on the first surface and/or the second surface on which the at least one pattern is formed, wherein the at least one pattern may include a plurality of recesses spaced apart from each other at designated intervals and formed on the first surface and/or the second surface. |
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Bibliography: | Application Number: EP20220752889 |