FILM FORMING APPARATUS AND FILM FORMING METHOD

• Main Authors: Takahashi, Kota, Matsuo, Kazuhiro, Ishimaru, Tomoki, Toratani, Kenichiro, Toda, Masaya
• Format: Patent
• Language: English; French; German
• Published: 01.11.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A film forming apparatus (100) of embodiments includes: a chamber (10) including a sidewall (10a); a shower head (12) provided in an upper part of the chamber (10); a holder (14) provided in the chamber (10) holding a substrate (W); a first gas supply pipe (16) configured to supply a first gas to the shower head (12); a first valve (V1) provided in the first gas supply pipe (16); at least one gas supply portion (24) provided in a region of the chamber (10) other than the shower head (12); a second gas supply pipe (22) configured to supply a second gas to the at least one gas supply portion (24); a second valve (V2) provided in the second gas supply pipe (22); a gas exhaust pipe (26) configured to exhaust a gas from the chamber; and an exhaust device (32) connected to the gas exhaust pipe (26) .