PACKAGING BLANK, METHOD FOR MOLDING A LID-SPOUT ASSEMBLY ONTO A PACKAGING BLANK, LID SPOUT ASSEMBLY, PACKAGE HAVING A LID-SPOUT ASSEMBLY AND METHOD AND APPARATUS FOR FORMING A PACKAGING BLANK
There is described a packaging blank (5) having a multilayer structure for forming a package (2) comprising a fibrous base layer (7), a layer of gas-barrier material (9), a plurality of layers of heat-seal plastic material (8), a hole (15) configured to allow the molding of a lid-spout assembly (4)...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
06.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | There is described a packaging blank (5) having a multilayer structure for forming a package (2) comprising a fibrous base layer (7), a layer of gas-barrier material (9), a plurality of layers of heat-seal plastic material (8), a hole (15) configured to allow the molding of a lid-spout assembly (4) about the hole (15) and a separation membrane (16) covering the hole (15) and comprising a layer of gas-barrier material. The separation membrane (16) comprises one or more weakening lines (17) defining a plurality of covering portions (18). |
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Bibliography: | Application Number: EP20230168886 |