PROTECTION OF INTERCONNECTS AND DEVICES IN A PACKAGED QUANTUM BIT STRUCTURE
A semiconductor device comprises a first chip layer, having a first chip layer front-side and a first chip layer back-side, a qubit chip layer, having a qubit chip layer front-side and a qubit chip layer back-side, the qubit chip layer front-side operatively coupled to the first chip layer front-sid...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English French German |
Published |
25.10.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A semiconductor device comprises a first chip layer, having a first chip layer front-side and a first chip layer back-side, a qubit chip layer, having a qubit chip layer front-side and a qubit chip layer back-side, the qubit chip layer front-side operatively coupled to the first chip layer front-side with a set of bump-bonds, a set of through-silicon vias (TSVs) connected to at least one of: the first chip layer back-side or the qubit chip layer back-side and a cap wafer metal bonded to at least one of: the qubit chip layer back-side or the first chip layer back-side. |
---|---|
Bibliography: | Application Number: EP20210836484 |