HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embod...

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Main Authors YEUNG, Lily, FITZPATRICK, Richard, HODGE, Ronald, HAN, Alan, ZADEREJ, Victor, O'CONNOR, Gary
Format Patent
LanguageEnglish
French
German
Published 11.10.2023
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Abstract A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.
AbstractList A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.
Author ZADEREJ, Victor
HODGE, Ronald
O'CONNOR, Gary
HAN, Alan
YEUNG, Lily
FITZPATRICK, Richard
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DocumentTitleAlternate DISPOSITIFS ÉLECTRONIQUES DE GRANDE PUISSANCE ET LEURS PROCÉDÉS DE FABRICATION
HOCHLEISTUNGSELEKTRONIKVORRICHTUNGEN UND VERFAHREN ZUR HERSTELLUNG DAVON
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Snippet A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including...
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SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
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