HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embod...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
11.10.2023
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Subjects | |
Online Access | Get full text |
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Abstract | A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided. |
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AbstractList | A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided. |
Author | ZADEREJ, Victor HODGE, Ronald O'CONNOR, Gary HAN, Alan YEUNG, Lily FITZPATRICK, Richard |
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DocumentTitleAlternate | DISPOSITIFS ÉLECTRONIQUES DE GRANDE PUISSANCE ET LEURS PROCÉDÉS DE FABRICATION HOCHLEISTUNGSELEKTRONIKVORRICHTUNGEN UND VERFAHREN ZUR HERSTELLUNG DAVON |
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Notes | Application Number: EP20210900208 |
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Snippet | A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME |
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