HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embod...

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Bibliographic Details
Main Authors YEUNG, Lily, FITZPATRICK, Richard, HODGE, Ronald, HAN, Alan, ZADEREJ, Victor, O'CONNOR, Gary
Format Patent
LanguageEnglish
French
German
Published 11.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.
Bibliography:Application Number: EP20210900208