MICROCUT PATTERNED TRANSFER ARTICLES

A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. Th...

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Bibliographic Details
Main Authors JOHNSTON, Raymond P, MESSINA, Matthew C, JONES, Scott J, SULLIVAN, John J, CLARKE, Graham M, GOTRIK, Kevin W
Format Patent
LanguageEnglish
French
German
Published 11.10.2023
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Summary:A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers.
Bibliography:Application Number: EP20210900180