MICROCUT PATTERNED TRANSFER ARTICLES
A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. Th...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
11.10.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers. |
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Bibliography: | Application Number: EP20210900180 |