SENSING ELEMENT AND RELATED METHODS

A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device (101) formed mainly from a silicon substrate (102) and having a microelectromechanical system (104) without the use of quartz or polymer, wherein the at least one acoustic sensin...

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Bibliographic Details
Main Authors LIN, Yizhen, MACDONALD, Robert James, ESLER, David Richard, YOST, Nicholas
Format Patent
LanguageEnglish
French
German
Published 27.09.2023
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Summary:A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device (101) formed mainly from a silicon substrate (102) and having a microelectromechanical system (104) without the use of quartz or polymer, wherein the at least one acoustic sensing device (101) detects a torque associated with a metal object (120) subject to said torque, and a high temperature bonding surface for directly connecting the sensing element to the metal object (120) via a high temperature connecting processes comprising at least one of soldering, metalizing and/or brazing, without the need for a polymer adhesive. Related sensors (100) using such sensing elements and methods are also disclosed herein.
Bibliography:Application Number: EP20230160841