SENSING ELEMENT AND RELATED METHODS
A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device (101) formed mainly from a silicon substrate (102) and having a microelectromechanical system (104) without the use of quartz or polymer, wherein the at least one acoustic sensin...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
27.09.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device (101) formed mainly from a silicon substrate (102) and having a microelectromechanical system (104) without the use of quartz or polymer, wherein the at least one acoustic sensing device (101) detects a torque associated with a metal object (120) subject to said torque, and a high temperature bonding surface for directly connecting the sensing element to the metal object (120) via a high temperature connecting processes comprising at least one of soldering, metalizing and/or brazing, without the need for a polymer adhesive. Related sensors (100) using such sensing elements and methods are also disclosed herein. |
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Bibliography: | Application Number: EP20230160841 |