INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTERNING

Methods for making thin-films on semiconductor substrates which may be patterned using EUV, include: depositing the organometallic polymer-like material onto the surface of the semiconductor substrate, exposing the surface to EUV to form a pattern, and developing the pattern for later transfer to un...

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Main Authors TAN, Samantha S.H, PAN, Yang, LAVOIE, Adrien, WISE, Richard, LIN, Qinghuang, KANAKASABAPATHY, Sivananda Krishnan, YU, Jengyi, GOTTSCHO, Richard A, WEIDMAN, Timothy William, HUBACEK, Jerome, ALVI, Mohammed Haroon
Format Patent
LanguageEnglish
French
German
Published 30.08.2023
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Summary:Methods for making thin-films on semiconductor substrates which may be patterned using EUV, include: depositing the organometallic polymer-like material onto the surface of the semiconductor substrate, exposing the surface to EUV to form a pattern, and developing the pattern for later transfer to underlying layers. The deposition operations may be performed by chemical vapor deposition (CVD), atomic layer deposition (ALD), and ALD with a CVD component, such as a discontinuous, ALD-like process in which metal precursors and counter-reactants are separated in either time or space.
Bibliography:Application Number: EP20230173688