MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE

• Main Authors: HAQUE, Yusuf, BRYZEK, Janusz, WANG, Liang
• Format: Patent
• Language: English; French; German
• Published: 30.08.2023
• Subjects: DEAF-AID SETS; DIAGNOSIS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; FOR PERFORMING MECHANICAL WORK IN GENERAL; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MEDICAL OR VETERINARY SCIENCE; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY; PERFORMING OPERATIONS; PUBLIC ADDRESS SYSTEMS; SURGERY; TRANSPORTING

An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.