BONDING SYSTEM AND BONDING METHOD

• Main Authors: LIU, Tianjian, CAO, Ruixia, TIAN, Yingchao, ZHANG, Wei
• Format: Patent
• Language: English; French; German
• Published: 23.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure disclose a bonding system and a bonding method. The bonding system includes a bonding assembly, a first alignment assembly, and a second alignment assembly. The bonding assembly includes a bonding head and a first optical path penetrating the bonding head. The first alignment assembly is configured to determine an offset of the picking surface with respect to a horizontal plane when the bonding head is located at a first position. The bonding assembly is further configured to drive, according to the offset, the bonding head to move to a second position parallel to the horizontal plane. The first alignment assembly is further configured to transmit a detection optical signal to a first end via a second end of the first optical path when the bonding head is located at the second position. The first alignment assembly is further configured to receive a reflection optical signal of the detection optical signal reflected by a first to-be-bonded die, and determine a first deviation value between a current position of the first to-be-bonded die and a first target position according to the received reflection optical signal. The second alignment assembly is configured to determine a second deviation value between a current position of a second to-be-bonded die on the wafer and a second target position.